Comparison of surface passivation of crystalline silicon by a-Si:H with and without atomic hydrogen treatment using hot-wire chemical vapor deposition

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2011

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Schüttauf, J. W. A.ISNI 000000039514974X
der Werf, C. H. M. Van
van Sark, W.G.J.H.M.ORCID 0000-0002-4738-1088ISNI 0000000397039608
Rath, J. K.ISNI 0000000350358433
Schropp, R.E.I.ISNI 000000008094399X

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Abstract

We compared surface passivation of c-Si by a-Si:H with and without atomic hydrogen treatment prior to a-Si:H deposition. The atomic hydrogen is produced by hot-wire chemical vapor deposition (HWCVD). For this purpose, we deposited a-Si:H layers onto both sides of n-type FZ c-Si wafers and measured the minority carrier effective lifetime and implied VOC for different H treatment times ranging from 5 s to 30 s prior to a-Si:H deposition. We found that increasing hydrogen treatment times led to lower effective lifetimes and implied VOC values for the used conditions. The treatments have been performed in a new virgin chamber to exclude Si deposition from the chamber walls. Our results show that a short atomic hydrogen pretreatment is already detrimental for the passivation quality which might be due to the creation of defects in the c-Si. AFM measurements do not show any change in the surface roughness of the different samples.

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Schüttauf, J W A, der Werf, C H M V, van Sark, W G J H M, Rath, J K & Schropp, R E I 2011, 'Comparison of surface passivation of crystalline silicon by a-Si:H with and without atomic hydrogen treatment using hot-wire chemical vapor deposition', Thin Solid Films, vol. 519, no. 14, pp. 4476-4478. https://doi.org/10.1016/j.tsf.2011.01.319